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8月31日，地平线机器人公布2026年上半年业绩：公司营收达到20.55亿元，综合毛利率维持在66%。征程系列芯片出货量同比增长12.1%，达到221.8万套。
On August 31, Horizon Robotics announced its results for the first half of 2026: revenue reached 2.055 billion yuan, while its overall gross margin remained at 66%. Shipments of Journey-series chips rose 12.1% year over year to 2.218 million units.
这批芯片背后，是近500款车型定点，其中中高阶智能驾驶车型接近130款。地平线同时在合资和海外市场推进合作，与博世、电装、酷睿程、智驾新程、安斯泰莫等伙伴进入合资车企供应链；出口车型定点已超过60款，且其中多款搭载中高阶智能驾驶硬件平台。公司没有披露这些定点全部量产的时间，因此“定点”仍是车型项目确认，不等同于车辆已经大规模交付。
Behind these chip shipments are nominations for nearly 500 vehicle models, including close to 130 models with mid- to high-level intelligent-driving capabilities. Horizon is also advancing partnerships in joint-venture and overseas markets, entering the supply chains of joint-venture automakers with partners including Bosch, Denso, CoreChips, Zhijia Xincheng and Amstemon. Nominations for export models have surpassed 60, several of which feature mid- to high-level intelligent-driving hardware platforms. The company did not disclose when all of these nominated models will enter mass production, so a “nomination” still indicates confirmation of a vehicle project and does not mean the vehicles have already begun large-scale deliveries.
地平线增长更快的部分来自授权及服务。上半年该业务收入达到11.29亿元，同比增长52.7%，高于产品及解决方案的14.8%增幅。所谓开放底层授权，是把BPU、芯片、基座模型、算法和工具链交给客户，让车企及合作伙伴在平台上自主开发；大众集团合作的酷睿程项目，就是这一模式的案例，双方计划于2027年下半年启动L3级自动驾驶交付。
Horizon’s faster growth is coming from licensing and services. Revenue from this business reached 1.129 billion yuan in the first half, up 52.7% year over year, outpacing the 14.8% growth in products and solutions. Open underlying-platform licensing means providing customers with the BPU, chips, foundation models, algorithms and toolchains so automakers and partners can develop independently on the platform. The CoreChips project with Volkswagen Group is an example of this model, with the two companies planning to begin Level 3 automated-driving deliveries in the second half of 2027.
具体来说，这会把汽车智能化从采购一颗芯片，推进到共享一套可开发的计算与软件底座。车企可以在同一平台上整合驾驶辅助和座舱功能，供应商则能把这套技术复制到更多车型及边缘设备。HSD V2.0搭载车辆的智能辅助驾驶功能开启比例已超过88%；星空舱驾融合整车智能体芯片和KKClaw整车智能体操作系统计划于2026年第四季度量产，征程7预计于2027年正式推出。公司还称，相关技术正通过合作伙伴进入具身智能、无人物流车、家庭智能体和电动两轮车等场景，
Specifically, this shifts automotive intelligence from purchasing a single chip to sharing a developable computing and software foundation. Automakers can integrate driver assistance and cockpit functions on the same platform, while suppliers can replicate the technology across more vehicle models and edge devices. The activation rate for intelligent driver-assistance functions on vehicles equipped with HSD V2.0 has exceeded 88%. The Xingkong cockpit-and-driving fusion vehicle intelligence-agent chip and KKClaw vehicle intelligence-agent operating system are scheduled for mass production in the fourth quarter of 2026, while Journey 7 is expected to officially launch in 2027. The company also said the technology is entering scenarios including embodied intelligence, autonomous logistics vehicles, home intelligence agents and electric two-wheelers through its partners,